Design For Assembly-HDI Prevention of Solder Bridging

By |2019-09-12T15:50:29-07:00September 11th, 2019|Advanced Technique, Articles, General|

Design For Assembly - Prevention of Solder Bridging in High Density Interconnect PCB Components This is an advanced DFA technique developed by Cherie Litson in working with Microsoft engineers on the PCB design and manufacturing [...]